DocumentCode
2023952
Title
Integration aspects of RF-MEMS technologies
Author
Lisec, T. ; Wagner, B.
Author_Institution
Fraunhofer Inst. for Silicon Technol., Germany
fYear
2005
fDate
3-4 Oct. 2005
Firstpage
297
Lastpage
300
Abstract
This paper presents an overview about existing fabrication and packaging solutions for RF MEMS switches with regard to integration with other passive or active devices. Achievements and problems are discussed from a technological point of view.
Keywords
microswitches; RF MEMS switches; fabrication solutions; packaging solutions; Biomembranes; Dielectric substrates; Fabrication; Microswitches; Radio frequency; Radiofrequency microelectromechanical systems; Semiconductor device packaging; Switches; Switching circuits; Varactors;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide and Other Semiconductor Application Symposium, 2005. EGAAS 2005. European
Conference_Location
Paris
Print_ISBN
88-902012-0-7
Type
conf
Filename
1637209
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