Title :
Packaging process research of power MOSFET against salt spray corrosion, in aerospace electronic products
Author :
Niu, Yucheng ; Su, Xiao ; Zhao, Dan
Author_Institution :
Shandong Aerospace Electronics Technology Institute, Yantai, China
Abstract :
In order to improve the salt spray corrosion resistance of the aerospace electronic products with the power MOSFET, meet the high reliability requirements, improve the packaging process of power MOSFET. This paper starts from the mechanism of packaging materials´salt spray corrosion, through the packaging materials selection and process control, a lot of basic research is carried out against salt spray corrosion of power MOSFET.
Keywords :
Coatings; Gold; Iron; MOSFET; Military standards; Nickel; Welding; against salt spray; packaging process; power MOSFET;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236801
