Title :
Design and fabrication of a silicon microvalve for large flow application
Author :
Li, Yongjun ; Deng, Ning ; Huang, Xian ; Zhang, Shengchang
Author_Institution :
Institute of Microelectronics, Tsinghua University, Beijing, China
Abstract :
This paper presents a normally closed Electro-thermal driven 3-way gate micro-valve which is able to meet the requirements of industrial applications like large flow rate and high pressure. The micro-valve consists of three layers of glass-silicon-glass bonded together. The total chip size of the valve is 10mm*8.2mm, with a thickness of 1.32mm. The lateral thickness of the actuator and movable parts in the silicon layer is 300µm. The experimental results show that a mechanical linkage capable of over 150µm of motion is realized under a voltage of 6V, which is good enough for control the valve.
Keywords :
Cooling; Logic gates; Valves; Electro-thermal actuation; glass-silicon-glass bonded; large flow application; microvalve;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236802