• DocumentCode
    2024054
  • Title

    Design and fabrication of a silicon microvalve for large flow application

  • Author

    Li, Yongjun ; Deng, Ning ; Huang, Xian ; Zhang, Shengchang

  • Author_Institution
    Institute of Microelectronics, Tsinghua University, Beijing, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    1233
  • Lastpage
    1237
  • Abstract
    This paper presents a normally closed Electro-thermal driven 3-way gate micro-valve which is able to meet the requirements of industrial applications like large flow rate and high pressure. The micro-valve consists of three layers of glass-silicon-glass bonded together. The total chip size of the valve is 10mm*8.2mm, with a thickness of 1.32mm. The lateral thickness of the actuator and movable parts in the silicon layer is 300µm. The experimental results show that a mechanical linkage capable of over 150µm of motion is realized under a voltage of 6V, which is good enough for control the valve.
  • Keywords
    Cooling; Logic gates; Valves; Electro-thermal actuation; glass-silicon-glass bonded; large flow application; microvalve;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236802
  • Filename
    7236802