DocumentCode :
2024063
Title :
Development of ultra thin plate-type heat pipe with less than 1 mm thickness
Author :
Aoki, Hidetaka ; Shioya, Nobuyoshi ; Ikeda, Makoto ; Kimura, Yuichi
Author_Institution :
Furukawa Electr. Co., Ltd., Hiratsuka, Japan
fYear :
2010
fDate :
21-25 Feb. 2010
Firstpage :
217
Lastpage :
222
Abstract :
Authors are reporting development of ultra thin heat pipe and its performance. The ultra thin heat pipe has thickness less than 1.0 mm and high capability of maximum heat transfer capacity, so that this heat pipe can be installed for narrow space, in which it have been difficult to apply the plate heat pipe so far, of the ultra compact information equipment such as Net Book PC. In this ultra thin heat pipe, the mesh wick which was conducted oxidation-reduction process in high temperature was used in order to obtain sufficient capillary pressure for circulation of the working fluid. The ultra thin heat pipe consists of this mesh wick and the copper container which has thin wall. This structure ensures both sufficient capillary pressure and space of vapor flow. Two kinds of the ultra thin heat pipe were made; one was 1.0 mm thickness and the other was 0.7 mm thickness. These heat pipes had high maximum heat transfer capacity comparing with conventional groove heat pipe. In this paper, we proposed the ultra thin heat pipe which consists of high capillary pressure wick, and experimental investigation is discussed.
Keywords :
capillarity; heat pipes; heat transfer; thermal management (packaging); high capillary pressure wick; maximum heat transfer capacity; mesh wick; oxidation-reduction process; ultra compact information equipment; ultra thin plate type heat pipe; vapor flow; working fluid circulation; Containers; Copper; Heat transfer; Resistance heating; Space heating; Temperature; Thermal force; Thermal loading; Thermal resistance; Water heating; Capillary Force Limit; Capillary Pressure; Maximum Heat Transfer Capacity; Mesh Wick Structure; Pressure Drop; Thermal Resistance; Thin Heat Pipe;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
Conference_Location :
Santa Clara, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4244-9458-3
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/STHERM.2010.5444289
Filename :
5444289
Link To Document :
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