• DocumentCode
    2024190
  • Title

    Proactive power migration to reduce maximum value and spatiotemporal non-uniformity of on-chip temperature distribution in homogeneous many-core processors

  • Author

    Cho, Moonju ; Sathe, N. ; Gupta, Madhu ; Kumar, Sudhakar ; Yalamanchilli, S. ; Mukhopadhyay, Saibal

  • Author_Institution
    Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2010
  • fDate
    21-25 Feb. 2010
  • Firstpage
    180
  • Lastpage
    186
  • Abstract
    This paper presents a proactive spatiotemporal power multiplexing method to manage the thermal field in many-core processors. We first analyze the thermal field in many core processors in deep nanometer (to 16nm nodes). We show that the thermal field in many-core can have significant spatiotemporal non-uniformity along with high maximum temperature. For better reliability and improved cooling efficiency, it is important to achieve a lower peak temperature and a more uniform thermal field under all workload or utilization conditions. We propose proactive power migration to reduce spatial and temporal temperature difference, by redistributing the heat generating locations. The effectiveness of the proposed method is demonstrated for a 256 core many-core processor in predictive 16nm nodes.
  • Keywords
    cooling; integrated circuit reliability; microprocessor chips; spatiotemporal phenomena; temperature distribution; thermal management (packaging); cooling; heat generating locations; homogeneous many-core processors; on-chip temperature distribution; proactive power migration; reliability; spatiotemporal nonuniformity; spatiotemporal power multiplexing; thermal field management; CMOS technology; Liquid cooling; Microchannel; Microprocessors; Moore´s Law; Parallel processing; Silicon; Spatiotemporal phenomena; Temperature distribution; Transistors; Many-core processor; Non-uniform temperature distribution; Proactive power migration; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-9458-3
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2010.5444295
  • Filename
    5444295