DocumentCode
2024190
Title
Proactive power migration to reduce maximum value and spatiotemporal non-uniformity of on-chip temperature distribution in homogeneous many-core processors
Author
Cho, Moonju ; Sathe, N. ; Gupta, Madhu ; Kumar, Sudhakar ; Yalamanchilli, S. ; Mukhopadhyay, Saibal
Author_Institution
Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2010
fDate
21-25 Feb. 2010
Firstpage
180
Lastpage
186
Abstract
This paper presents a proactive spatiotemporal power multiplexing method to manage the thermal field in many-core processors. We first analyze the thermal field in many core processors in deep nanometer (to 16nm nodes). We show that the thermal field in many-core can have significant spatiotemporal non-uniformity along with high maximum temperature. For better reliability and improved cooling efficiency, it is important to achieve a lower peak temperature and a more uniform thermal field under all workload or utilization conditions. We propose proactive power migration to reduce spatial and temporal temperature difference, by redistributing the heat generating locations. The effectiveness of the proposed method is demonstrated for a 256 core many-core processor in predictive 16nm nodes.
Keywords
cooling; integrated circuit reliability; microprocessor chips; spatiotemporal phenomena; temperature distribution; thermal management (packaging); cooling; heat generating locations; homogeneous many-core processors; on-chip temperature distribution; proactive power migration; reliability; spatiotemporal nonuniformity; spatiotemporal power multiplexing; thermal field management; CMOS technology; Liquid cooling; Microchannel; Microprocessors; Moore´s Law; Parallel processing; Silicon; Spatiotemporal phenomena; Temperature distribution; Transistors; Many-core processor; Non-uniform temperature distribution; Proactive power migration; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
Conference_Location
Santa Clara, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-9458-3
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2010.5444295
Filename
5444295
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