Analysis on the causes of decline of MLCC insulation resistance

Author

Jiang, Wei ; Hu, YongDa ; Bao, ShengXiang ; Lijie, Song ; Yuwei, Zheng ; Cui, Yongqiang ; Qiang, Li

Author_Institution

State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China

fYear

2015

fDate

11-14 Aug. 2015

Firstpage

1255

Lastpage

1257

Abstract

In this paper, based on the results of SEM and EDS analysis, I would like to share the discovery of MLCC failure due to insulation resistance. For external factors, The defects which caused by mechanical stress can lead to lack of insulation resistance. For the intrinsic factors, MLCC insulation resistance failure is due to the presence of defects, and the main defects include void in ceramic dielectric and delamination of porcelain body and inner electrode. These defects are difficult to analyze. With the help of SEM electron microscope detection, these defets can be see. The reason is the poor control of sintering process.In the test,these defects will cause the capacitor quickly form a conductive channel, finally lead to insulation resistance failure.

Keywords

Capacitors; Ceramics; Electrodes; Immune system; Nonhomogeneous media; Failure analysis of MLCC; MLCC insulation resistance; SEM and EDS; decline of MLCC insulation resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2015 16th International Conference on

Conference_Location

Changsha, China

Type

conf

DOI

10.1109/ICEPT.2015.7236807

Filename

7236807