A flip-chip single-pole three-throw switch with integrated bypass LNA for WLAN applications

A SP3T switch with an integrated bypass LNA has been designed as a flip-chip die using a GaAs E/D PHEMT process. The part consists of a standard three-throw switch with TX, RX and Bluetooth ports and includes a single-stage LNA featuring a low-gain/shut-off bypass path integrated on the die. The LNA bypass/shut-off functionality is achieved utilizing an enhancement-mode PHEMT to control biasing. GaAs wafer bumping is a technology that various M/A-COM technology solutions (MTS) customers are mandating in order to participate on next generation products. The main advantages of flip-chip technology over a conventional wire bonded plastic package are smaller footprint, reduced weight and improved electrical performance.