Title :
Microstructure and mechanical properties of Al/Sn-Zn-X/Cu solder joints
Author :
Liu, Jiaxi ; Huang, Mingliang ; Zhao, Ning ; Zhang, Liwen
Author_Institution :
Laboratory of Electronic Packaging Materials, School of Materials Science & Engineering, Dalian University of Technology, 116024, China
Abstract :
Three Sn-Zn based solders were developed to join Al and Cu. The microstructure of bulk Sn-Zn based solders mainly consists of Sn-Zn-X eutectic, needle-like Zn rich solid solution and small Ni3Zn14 particles. The wettability of the Sn-Zn based solders on Al and Cu substrates is better than that of Sn-9Zn eutectic solder due to the lower surface tension of the liquid solders. In the Al/Sn-Zn-X/Cu solder joints, Al4.2Cu3.2Zn0.7 intermetallic compound (IMC) layer formed at the solder/Cu interface, while Al-Zn-Sn solid solutions formed at the Al/solder interface. Since all the fractures of the solder joints occurred at the Al/solder interfaces but not at the solder/Cu interfaces, the bonding strength with Al substrate determined the final strength of the whole solder joint. The 1# solder, which contains lest Zn, showed the best corrosion resistance.
Keywords :
Artificial intelligence; Electric potential; Nickel; Solids; Substrates; Thermal conductivity; Al-Cu solder joint; Sn-Zn-X solder; electrochemical corrosion behavior; mechanical property; micrstructure;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236810
