Title :
Electrical characterization of a 3-D plastic IC package (MCM-V)
Author :
Hayes, Thomas ; Barrett, John
Author_Institution :
Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland
Abstract :
A 3-D, plastic-encapsulated, vertical multichip module packaging technology is electrically characterized and compared to conventional IC packages. Numerical modelling and experimental measurements were carried out to determine package resistances, capacitances and inductances
Keywords :
integrated circuit packaging; 3D plastic IC package; MCM-V; capacitance; electrical characterization; inductance; plastic encapsulation; resistance; vertical multichip module; Capacitance measurement; Electric variables measurement; Electrical resistance measurement; Inductance measurement; Integrated circuit packaging; Laser beam cutting; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device measurement; Testing;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594091
