• DocumentCode
    2024382
  • Title

    A complete 38 GHz transmit and receive chip set in low cost surface mount package

  • Author

    Morkner, Henrik ; Fujii, Kohei ; Phan, Khantran ; Kumar, Sushil

  • Author_Institution
    Wireless Semicond. Div., Avago Technol. Inc., San Jose, CA, USA
  • fYear
    2009
  • fDate
    28-29 Sept. 2009
  • Firstpage
    316
  • Lastpage
    319
  • Abstract
    While most Point-to-Point radio systems migrate to SMT (Surface Mount Technology) over chip-and-wire, the 38 GHz band has provided the largest challenge. This paper demonstrates a commercially viable complete SMT solution to receive LNA-down-converter and transmit up-converter, VGA, power amp and directional power detector. The receive chain provides 10 dB conversion gain with 4.5 dB NF. The transmit chain provides 26 dB maximum total gain with 24 dB gain control and 30 dBm maximum power out at 1 dB compression. The amplifiers are housed in 5times5 mm packages while the detector uses a chip scale 1times0.5 mm package. All cover the 37 to 42 GHz radio bands. This is the only known complete SMT Tx/Rx solution to be published or demonstrated.
  • Keywords
    HEMT integrated circuits; MMIC power amplifiers; chip scale packaging; field effect MMIC; microwave links; surface mount technology; LNA-down-converter; PHEMT MMIC; SMT; VGA; broadband variable gain amplifier; chip scale package; directional power detector; frequency 37 GHz to 42 GHz; gain 10 dB; gain 24 dB; gain 26 dB; noise figure 4.5 dB; point-to-point radio system; power amplifier; size 5 mm; surface mount technology; up-converter; Costs; Detectors; FETs; Gain control; Low-noise amplifiers; MMICs; Packaging; Radio frequency; Resistors; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuits Conference, 2009. EuMIC 2009. European
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-4749-7
  • Type

    conf

  • Filename
    5296417