Thermal characteristics of TIMs with elliptical particles

Author

Khiabani, Reza H ; Joshi, Yash ; Aidun, Cyrus K

Author_Institution

G. W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2010

fDate

21-25 Feb. 2010

Firstpage

100

Lastpage

106

Abstract

In this study, direct numerical simulations of suspended particles are used to characterize the heat transfer properties of TIMs. The computational method is based on the solution of a thermal lattice-Boltzmann method. Based on the simulations, the effect of particle parameters such as loading, thermal conductivity and size on the thermal resistance of the TIM can be predicted. The effect of particle shape is also considered. Elliptical particles with different aspect ratios are examined. Cylindrical particle is a special case with aspect ratio of 1. The results are compared with existing data. The results can be used to design TIM for better thermal performance.

Keywords

heat transfer; lattice Boltzmann methods; numerical analysis; thermal conductivity; thermal resistance; TIM; computational method; cylindrical particle; direct numerical simulation; elliptical particles; heat transfer properties; particle parameter effect; particle shape effect; suspended particles; thermal conductivity; thermal lattice-Boltzmann method; thermal resistance; Computational modeling; Conducting materials; Electronic packaging thermal management; Heat transfer; Numerical simulation; Predictive models; Thermal conductivity; Thermal loading; Thermal resistance; Viscosity; Particle laden Thermal Interface Material; numerical simulation; suspended particles; thermal Lattice-Boltzmann method;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE

Conference_Location

Santa Clara, CA

ISSN

1065-2221

Print_ISBN

978-1-4244-9458-3

Electronic_ISBN

1065-2221

Type

conf

DOI

10.1109/STHERM.2010.5444306

Filename

5444306