• DocumentCode
    2024489
  • Title

    Wafer level high precision small size inductors for RF application

  • Author

    Hongyan, Guo ; Xinjiang, Long ; Xuan, Hua ; Li, Zhang ; Kim Hwee, Tan ; CM, Lai

  • Author_Institution
    Jiangyin Changdian Advanced Packaging Co. Ltd, Jiangsu, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    1302
  • Lastpage
    1304
  • Abstract
    Chip inductors fabricated via wafer level package technology were designed, fabricated and measured. High Q factor and high precision were achieved which can fulfill the RF application requirements. All the detail information was illustrated in this paper.
  • Keywords
    Monitoring; RNA; Radio frequency; TV; RF application; chip inductor; wafer level package;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236818
  • Filename
    7236818
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2024489