Title :
Wafer level high precision small size inductors for RF application
Author :
Hongyan, Guo ; Xinjiang, Long ; Xuan, Hua ; Li, Zhang ; Kim Hwee, Tan ; CM, Lai
Author_Institution :
Jiangyin Changdian Advanced Packaging Co. Ltd, Jiangsu, China
Abstract :
Chip inductors fabricated via wafer level package technology were designed, fabricated and measured. High Q factor and high precision were achieved which can fulfill the RF application requirements. All the detail information was illustrated in this paper.
Keywords :
Monitoring; RNA; Radio frequency; TV; RF application; chip inductor; wafer level package;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236818
