Title :
Metal filament enhanced thermal energy storage applied to on-demand cooling of high power-density hand-held electronics
Author :
Yaquinto, Matt ; Wirtz, Richard
Author_Institution :
Univ. of Nevada, Reno, Reno, NV, USA
Abstract :
A thin-slab thermal energy storage volume with embedded metal filaments sandwiched between an electronics heat spreader plate and the hand-held unit skin is analyzed. A numerical model is created and results are compared with temperature responses of a plane 1-D pad containing no metal filaments. Results show the addition of fins reduces operating temperatures by 30% in addition to reducing the phase change material´s re-solidification time by approximately 37%. Additionally, a thermal response analytical model is developed. The analytical model results correlate well against numerical simulations. A parametric study outlines the effects of the Biot number and power level impact on performance.
Keywords :
notebook computers; phase change materials; thermal energy storage; thermal management (packaging); Biot number; electronics heat spreader plate; handheld electronics; metal filaments; on-demand cooling; phase change material; plane 1D pad; power level impact; thermal response analytical model; thin-slab thermal energy storage volume; Electronics cooling; Energy management; Energy storage; Heat sinks; Heat transfer; Phase change materials; Skin; Temperature; Thermal conductivity; Thermal management;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-9458-3
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2010.5444311
