Electrical simulation of gold bonding wire with different parameters

Gold bonding wire interconnects is an attractive choice for high performance IC package. As the gold bonding wire of the package may have impacts on the performance of the circuit, thus, it is important to analyze the electrical characteristics of the gold bonding wire in the high-frequency IC package design. In this paper, the electrical characteristics of gold bonding wire used in high frequency integrated circuits have been discussed. First, theoretical analysis was preformed. Then, a 3D model of gold bonding wire is established using the simulation software. Based on RLC and S parameters extracted from the model, the effects on the electrical characteristics of bonding wire with different parameters are primarily analyzed, such as shape, diameter, arch height and span. The simulation results can provide a practical guide for the package design.