Electroless deposition of copper alloy in the PEG additive

Author

Wenjing Zhang ; Ning Wang ; Tao Hang ; Ming Li

Author_Institution

Sch. of Phys. Sci. & Technol., Shanghai Tech Univ., Shanghai, China

fYear

2015

fDate

11-14 Aug. 2015

Firstpage

1363

Lastpage

1366

Abstract

In this paper, Cu alloy with rough micro-scale morphology was successfully electroless plated with the help of polyethylene glycol (PEG) additive. The morphology was observed by SEM and electrochemical mechanism of micro-nano-structured Cu alloy formation was analyzed using linear sweep voltammetry. Results show that increase in PEG concentration could inhibit the anodic and cathodic reaction and the growth of secondary structure on the cone surface. The different type of crystallization modifier could result in different surface morphology. And the adsorption effect of PEG increases with the molecular weight.

Keywords

adsorption; copper alloys; crystallisation; electrochemistry; electroless deposition; molecular weight; nanofabrication; nanostructured materials; scanning electron microscopy; surface morphology; voltammetry (chemical analysis); PEG additive; PEG concentration; SEM; adsorption; anodic reaction; cathodic reaction; cone surface; copper alloy; crystallization; electrochemical mechanism; electroless deposition; electroless plating; linear sweep voltammetry; microstructure copper alloy; molecular weight; polyethylene glycol additive; rough microscale morphology; secondary structure growth; surface morphology; Additives; Metals; Copper alloy; Electroless plating; PEG; micro/nano structure;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2015 16th International Conference on

Conference_Location

Changsha

Type

conf

DOI

10.1109/ICEPT.2015.7236832

Filename

7236832