DocumentCode
2025306
Title
Effects of losses in power and ground planes in the simulation of simultaneous switching noise
Author
Fang, Jiayuan ; Xue, Danwei ; Chen, Yuzhe
Author_Institution
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
109
Lastpage
112
Abstract
This paper presents a study of the effects of losses in power and ground planes on the simulation of simultaneous switching noise in electronic packaging. Numerical simulation schemes are developed by using recursive convolutions for computing frequency-dependent skin-effect loss. It is found that whether losses in metal planes can be ignored in simulations actually depends on the separation between adjacent metal planes
Keywords
losses; electronic packaging; frequency-dependent skin-effect loss; ground planes; losses; metal planes; power planes; recursive convolutions; simulation; simultaneous switching noise; Circuit noise; Clocks; Computational modeling; Differential equations; Electronics packaging; Magnetic separation; Magnetostatics; Numerical simulation; Performance loss; Power engineering computing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594103
Filename
594103
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