Title :
Effects of losses in power and ground planes in the simulation of simultaneous switching noise
Author :
Fang, Jiayuan ; Xue, Danwei ; Chen, Yuzhe
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
This paper presents a study of the effects of losses in power and ground planes on the simulation of simultaneous switching noise in electronic packaging. Numerical simulation schemes are developed by using recursive convolutions for computing frequency-dependent skin-effect loss. It is found that whether losses in metal planes can be ignored in simulations actually depends on the separation between adjacent metal planes
Keywords :
losses; electronic packaging; frequency-dependent skin-effect loss; ground planes; losses; metal planes; power planes; recursive convolutions; simulation; simultaneous switching noise; Circuit noise; Clocks; Computational modeling; Differential equations; Electronics packaging; Magnetic separation; Magnetostatics; Numerical simulation; Performance loss; Power engineering computing;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594103
