Optimization of structure for BGA packaging based on Taguchi method

The performance of ball grid array (BGA) electronic packaging was taken into investigated under specific power in this paper. The fields of temperature, thermal stress and strain were analyzed by the finite element analysis (FEA) software ANSYS. Furthermore, the structure of the BGA packaging was optimized based on the Taguchi method. The results of simulation show that thermal stress is caused by the expansion between different materials due to the uneven distribution of the temperature. Reasonable reduction of maximum stress can be achieved by decreasing the substrate width, chip thickness, ball interval as well as increasing the ball diameter. The maximum value of temperature and thermal stress decreases from 42.51°C, 199MPa to 40.86°C, 158MPa, respectively, through the parameter optimization of structure. The range analysis shows that geometry sizes of substrate and chip play significant roles in reducing the working temperature and thermal stress.