Phase change materials for passive cooling of active optical components

Author

Murphy, Eoin ; Michie, Craig ; White, Henry ; Johnstone, Walter

Author_Institution

Adv. Technol. Centre, BAE Syst., Bristol, UK

fYear

2012

fDate

11-13 Sept. 2012

Firstpage

11

Lastpage

12

Abstract

The use of a Phase Change Material (PCM) for short term passive cooling of a WDM-PON end node has been introduced and the temperature evolution at elevated temperatures modelled. It has been predicted that at temperatures in excess of the PCM melting point the PCM will hold electronic devices close to the melting point until the phase change is complete. This can be used as a method of cooling components when exposed briefly to extreme conditions and requires no direct power. The size and weight of the complete cooling system have been investigated for realistic scenarios.

Keywords

cooling; melting point; optical materials; passive optical networks; phase change materials; wavelength division multiplexing; PCM; WDM-PON end node; active optical components; melting point; passive cooling; phase change materials; Aerospace electronics; Aircraft; Cooling; Heating; Insulation; Phase change materials; Wavelength division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Avionics, Fiber- Optics and Photonics Technology Conference (AVFOP), 2012 IEEE

Conference_Location

Cocoa Beach, FL

Print_ISBN

978-1-4577-0757-5

Type

conf

DOI

10.1109/AVFOP.2012.6344054

Filename

6344054