DocumentCode
2025417
Title
Quantifying high frequency coupling between plated through holes within multilayer PCB structures
Author
Cornock, Leigh ; Dilworth, I.J.
Author_Institution
Sch. of Comput. Sci. & Electron. Eng., Univ. of Essex, Colchester, UK
fYear
2009
fDate
Sept. 29 2009-Oct. 1 2009
Firstpage
284
Lastpage
287
Abstract
In this paper we compare measurements and full wave 3D electromagnetic models of the coupling experienced between adjacent plated through holes, known as vias, within printed circuit boards with multiple layers of copper. We discuss comparative coupling configurations demonstrating methods for optimising designs to reduce parasitic via interaction.
Keywords
coupled circuits; electromagnetic devices; printed circuit design; copper; coupling configurations; design optimisation; full wave 3D electromagnetic models; multilayer PCB structures; Copper; Coupling circuits; Design methodology; Design optimization; Electromagnetic coupling; Electromagnetic measurements; Electromagnetic modeling; Frequency; Nonhomogeneous media; Printed circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2009. EuMC 2009. European
Conference_Location
Rome
Print_ISBN
978-1-4244-4748-0
Type
conf
Filename
5296456
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