Title :
Quantifying high frequency coupling between plated through holes within multilayer PCB structures
Author :
Cornock, Leigh ; Dilworth, I.J.
Author_Institution :
Sch. of Comput. Sci. & Electron. Eng., Univ. of Essex, Colchester, UK
fDate :
Sept. 29 2009-Oct. 1 2009
Abstract :
In this paper we compare measurements and full wave 3D electromagnetic models of the coupling experienced between adjacent plated through holes, known as vias, within printed circuit boards with multiple layers of copper. We discuss comparative coupling configurations demonstrating methods for optimising designs to reduce parasitic via interaction.
Keywords :
coupled circuits; electromagnetic devices; printed circuit design; copper; coupling configurations; design optimisation; full wave 3D electromagnetic models; multilayer PCB structures; Copper; Coupling circuits; Design methodology; Design optimization; Electromagnetic coupling; Electromagnetic measurements; Electromagnetic modeling; Frequency; Nonhomogeneous media; Printed circuits;
Conference_Titel :
Microwave Conference, 2009. EuMC 2009. European
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4748-0
