Title :
Thermal modeling and analysis for Ceramic Quad Flat No-lead packages
Author :
Bo, Peng ; Zhentao, Yang ; Lu, Zhao
Author_Institution :
The 13th Research Institute, China Electronics Technology Group Corporation, Shijiazhuang, China
Abstract :
In this paper, the steady equivalent thermal circuit model of Ceramic Quad Flat No-lead (CQFN) has been done. 3D model of CQFN48 was set up and analyzed by finite element method. The influencing factors of CQFN packages for thermal resistance (θJC) were pointed out. It is concluded that package thermal resistance can be reduced by reducing ceramic substrate thickness adequately, enlarging the Wpost diameter, adding Wpost array and reducing the Wpost array spacing, etc.
Keywords :
Heating; Metals; Reliability; Resistance; Silicon; CQFN; package; simulation; thermal resistanc;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha, China
DOI :
10.1109/ICEPT.2015.7236863
