• DocumentCode
    2025742
  • Title

    Thermal modeling and analysis for Ceramic Quad Flat No-lead packages

  • Author

    Bo, Peng ; Zhentao, Yang ; Lu, Zhao

  • Author_Institution
    The 13th Research Institute, China Electronics Technology Group Corporation, Shijiazhuang, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    1489
  • Lastpage
    1493
  • Abstract
    In this paper, the steady equivalent thermal circuit model of Ceramic Quad Flat No-lead (CQFN) has been done. 3D model of CQFN48 was set up and analyzed by finite element method. The influencing factors of CQFN packages for thermal resistance (θJC) were pointed out. It is concluded that package thermal resistance can be reduced by reducing ceramic substrate thickness adequately, enlarging the Wpost diameter, adding Wpost array and reducing the Wpost array spacing, etc.
  • Keywords
    Heating; Metals; Reliability; Resistance; Silicon; CQFN; package; simulation; thermal resistanc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236863
  • Filename
    7236863
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2025742