Effect of solder alloy composition on its solid-state bonding quality with Ni microcones

Author

Chen, Zhuo ; He, Hu ; Hu, Anmin ; Li, Ming

Author_Institution

State Key Laboratory of High Performance Complex Manufacturing, College of Mechanical and Electrical Engineering, Central South University, Changsha, 410083, China

fYear

2015

fDate

11-14 Aug. 2015

Firstpage

1497

Lastpage

1500

Abstract

A novel type of low-temperature bonding technique which uses metallic microcones to thermocompressively bond with solder is currently being extensively studied for its potential in achieving fine-pitch interconnection in advanced packaging and system integration. This paper compares the bonding of three different solder alloys with Ni microcones: Sn-3.5Ag, Sn-3.0Ag, and Sn-9Zn, in terms of deformation behavior during bonding process, joint morphology, and bonding strength. Solder composition affects the bonding process in three aspects: the deformation behavior during bonding process, the resistance to shear destruction, and the reactive diffusion that leads to IMC formation on the interface. Optimization of soft side material used for solid-state insertion bonding is also discussed in principle.

Keywords

Bonding; Joints; Morphology; Nickel; Surface morphology; deformation; insertion; intermetallics; microcones; solder; solid-state bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2015 16th International Conference on

Conference_Location

Changsha, China

Type

conf

DOI

10.1109/ICEPT.2015.7236865

Filename

7236865