DocumentCode
2025902
Title
Rapid evaluation of the root causes of BJT mismatch
Author
Drennan, P.G. ; McAndrew, Colin C. ; Bates, John ; Schroder, Dieter
Author_Institution
Motorola Inc., Tempe, AZ, USA
fYear
2000
fDate
2000
Firstpage
122
Lastpage
127
Abstract
This paper presents a new technique for the simple and rapid evaluation of the process and geometry parameter contributions to BJT mismatch. The pinched base sheet resistance variation, the geometric emitter size variation, and the ideal component of the emitter-base current variation can be uniquely determined from the Ic, Ib and β mismatch variances in the ideal region. The variation in the nonideal component of the base current can be evaluated from the Ib and β mismatch in low level injection region. The variation in extrinsic resistance can be evaluated from the Ic and Ib mismatch in the high current region. The mismatch evaluation can be performed with as few as six measurements per device type per die site.
Keywords
SPICE; bipolar transistors; semiconductor device measurement; semiconductor device models; BJT mismatch; SPICE; emitter-base current variation; extrinsic resistance; geometric emitter size variation; geometry parameter contributions; high current region; ideal component; low level injection region; mismatch variances; nonideal component; pinched base sheet resistance variation; process parameter contributions; rapid evaluation; test structure; Bipolar transistors; Circuits; MOSFETs; Mirrors; Signal design; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2000. ICMTS 2000. Proceedings of the 2000 International Conference on
Print_ISBN
0-7803-6275-7
Type
conf
DOI
10.1109/ICMTS.2000.844418
Filename
844418
Link To Document