• DocumentCode
    2025902
  • Title

    Rapid evaluation of the root causes of BJT mismatch

  • Author

    Drennan, P.G. ; McAndrew, Colin C. ; Bates, John ; Schroder, Dieter

  • Author_Institution
    Motorola Inc., Tempe, AZ, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    122
  • Lastpage
    127
  • Abstract
    This paper presents a new technique for the simple and rapid evaluation of the process and geometry parameter contributions to BJT mismatch. The pinched base sheet resistance variation, the geometric emitter size variation, and the ideal component of the emitter-base current variation can be uniquely determined from the Ic, Ib and β mismatch variances in the ideal region. The variation in the nonideal component of the base current can be evaluated from the Ib and β mismatch in low level injection region. The variation in extrinsic resistance can be evaluated from the Ic and Ib mismatch in the high current region. The mismatch evaluation can be performed with as few as six measurements per device type per die site.
  • Keywords
    SPICE; bipolar transistors; semiconductor device measurement; semiconductor device models; BJT mismatch; SPICE; emitter-base current variation; extrinsic resistance; geometric emitter size variation; geometry parameter contributions; high current region; ideal component; low level injection region; mismatch variances; nonideal component; pinched base sheet resistance variation; process parameter contributions; rapid evaluation; test structure; Bipolar transistors; Circuits; MOSFETs; Mirrors; Signal design; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2000. ICMTS 2000. Proceedings of the 2000 International Conference on
  • Print_ISBN
    0-7803-6275-7
  • Type

    conf

  • DOI
    10.1109/ICMTS.2000.844418
  • Filename
    844418