DocumentCode :
2026322
Title :
Molding process with high alignment precision for the LIGA technology
Author :
Both, A. ; Bacher, W. ; Heckele, M. ; Muller, K.D. ; Ruprecht, R. ; Strohrmann, M.
fYear :
1995
fDate :
29 Jan-2 Feb 1995
Firstpage :
186
Keywords :
Acceleration; CMOS technology; Geometry; Heating; Integrated circuit technology; Microscopy; Microstructure; Stability; Substrates; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE
Print_ISBN :
0-7803-2503-6
Type :
conf
DOI :
10.1109/MEMSYS.1995.472582
Filename :
472582
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2026322
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