DocumentCode
2026878
Title
Lossy interconnect modeling from TDR/T measurements
Author
Jong, J.M. ; Tripathi, V.K. ; Hayden, L.A. ; Janko, B.
Author_Institution
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
133
Lastpage
135
Abstract
An experimental technique for the equivalent circuit modeling of lossy interconnects is presented. The technique is based on the extended peeling algorithm and is used to extract the circuit model from the TDR/T measured data. The accuracy of the circuit model is affirmed by comparing the measured results with the simulated results for a thin film microstrip line
Keywords
time-domain reflectometry; TDR/T measurements; equivalent circuit modeling; extended peeling algorithm; lossy interconnects; simulation; thin film microstrip line; Circuit simulation; Circuit testing; Electrical resistance measurement; Integrated circuit interconnections; Loss measurement; Microstrip; Propagation losses; Reflection; Transmission line matrix methods; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594112
Filename
594112
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