Title :
Lossy interconnect modeling from TDR/T measurements
Author :
Jong, J.M. ; Tripathi, V.K. ; Hayden, L.A. ; Janko, B.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
An experimental technique for the equivalent circuit modeling of lossy interconnects is presented. The technique is based on the extended peeling algorithm and is used to extract the circuit model from the TDR/T measured data. The accuracy of the circuit model is affirmed by comparing the measured results with the simulated results for a thin film microstrip line
Keywords :
time-domain reflectometry; TDR/T measurements; equivalent circuit modeling; extended peeling algorithm; lossy interconnects; simulation; thin film microstrip line; Circuit simulation; Circuit testing; Electrical resistance measurement; Integrated circuit interconnections; Loss measurement; Microstrip; Propagation losses; Reflection; Transmission line matrix methods; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594112
