Abstract :
This paper dealt with the following topics: gallium arsenide circuits and applications; high efficiency-high power amplifiers; transceiver technologies; silicon devices for RF; advanced microwave technology modelling; voltage-controlled oscillators; wide band-gap technology; wide band-gap devices; physics-based modelling; EM modelling; silicon-based frequency generation circuits; conversion circuits; MM-wave circuits; application oriented MMICs; linear CAD techniques; nonlinear CAD techniques; tunable MEMS-based circuits; linearizing techniques for power amplifiers; RF MEMS fabrication; RF MEMS devices; reliability; packaging; module integration; robust amplifiers; active tunable circuits; industrial MM-wave PA´s; microwave linear PA´s; and, RFICs for wireless applications.
Keywords :
CAD; MMIC; amplifiers; gallium arsenide; micromechanical devices; microwave devices; millimetre wave devices; packaging; reliability; semiconductor devices; transceivers; voltage-controlled oscillators; EM modelling; MM-wave circuits; RF MEMS devices; RF MEMS fabrication; RFICs; active tunable circuits; advanced microwave technology modelling; application oriented MMICs; conversion circuits; gallium arsenide circuits; high efficiency-high power amplifiers; industrial MM-wave PA´s; linear CAD techniques; linearizing techniques; microwave linear PA´s; module integration; nonlinear CAD techniques; packaging; physics-based modelling; reliability; robust amplifiers; silicon devices; silicon-based frequency generation circuits; transceiver technology; tunable MEMS-based circuits; voltage-controlled oscillators; wide band-gap devices; wide band-gap technology; wireless applications;
Conference_Titel :
Microwave Integrated Circuits Conference, 2009. EuMIC 2009. European
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4749-7
