Title :
Emerging microwave packaging technologies
Author :
Kemerley, Robert T.
Author_Institution :
Solid State Electron. Directorate, US Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
Abstract :
Microwave and millimeter wave Multi-Chip assembly (MCA) packaging is an emerging technology that is of great importance to both defense and commercial applications. An ARPA/Tri-Service program entitled “High density microwave packaging (HDMP)” was initiated in late FY93. The objectives are to develop suitable designs, materials, and manufacturing processes to produce affordable, multi-chip assemblies and sub-arrays. The status of the program is reviewed
Keywords :
integrated circuit packaging; ARPA/Tri-Service program; HDMP; high density microwave packaging; microwave packaging technologies; millimeter wave packaging; multi-chip assembly packaging; sub-arrays; Assembly; Electronics packaging; Integrated circuit interconnections; Integrated circuit technology; MMICs; Microwave technology; Millimeter wave radar; Millimeter wave technology; Packaging machines; Solid state circuits;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594113
