DocumentCode :
2028109
Title :
A novel approach to assembly and interconnection for micro electro mechanical systems
Author :
Suga, T. ; Hosoda, N.
fYear :
1995
fDate :
29 Jan-2 Feb 1995
Firstpage :
413
Keywords :
Assembly systems; Bonding forces; Chemical technology; Diffusion bonding; Mechanical systems; Micromachining; Surface cleaning; Temperature; Thermal stresses; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE
Print_ISBN :
0-7803-2503-6
Type :
conf
DOI :
10.1109/MEMSYS.1995.472589
Filename :
472589
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2028109
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