DocumentCode
2028256
Title
Optoelectronic Packaging Technology For Datacommunications Present And Future
Author
Oprysko, Mtdest M.
Author_Institution
IBM Research Division
fYear
1992
fDate
16-19 Nov 1992
Firstpage
435
Lastpage
436
Keywords
Assembly; Boring; Consumer electronics; Electronics packaging; Fiber lasers; Gallium arsenide; Optical arrays; Optical fibers; Optical waveguides; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
LEOS '92, Conference Proceedings. IEEE Lasers and Electro-Optics Society, 1992 Annual Meeting
Print_ISBN
0-7803-0526-4
Type
conf
DOI
10.1109/LEOS.1992.694030
Filename
694030
Link To Document