DocumentCode
2028741
Title
Modeling of multiconductor microstrip bend discontinuities
Author
Boussetta, Chokri ; Ndagijimana, Fabien ; Chilo, Jean
Author_Institution
CNRS, Grenoble, France
fYear
1994
fDate
2-4 Nov 1994
Firstpage
148
Lastpage
150
Abstract
On of the main limitation of dynamic performance in a computer package may be due to the interconnections effects (transmission lines, discontinuities...). Accurate modeling of these passive components is necessary. A general methodology for package modeling based on the 3D TLM method is proposed
Keywords
microstrip discontinuities; 3D TLM method; IC packaging; computer package; dynamic performance; equivalent circuits; interconnections effects; microstrip bend discontinuities; multiconductor microstrip; passive components; Circuit simulation; Dielectric losses; Equivalent circuits; Frequency; Integrated circuit interconnections; Microstrip; Packaging; Scattering parameters; Solid modeling; Transmission line discontinuities;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594121
Filename
594121
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