Title :
Modeling of multiconductor microstrip bend discontinuities
Author :
Boussetta, Chokri ; Ndagijimana, Fabien ; Chilo, Jean
Author_Institution :
CNRS, Grenoble, France
Abstract :
On of the main limitation of dynamic performance in a computer package may be due to the interconnections effects (transmission lines, discontinuities...). Accurate modeling of these passive components is necessary. A general methodology for package modeling based on the 3D TLM method is proposed
Keywords :
microstrip discontinuities; 3D TLM method; IC packaging; computer package; dynamic performance; equivalent circuits; interconnections effects; microstrip bend discontinuities; multiconductor microstrip; passive components; Circuit simulation; Dielectric losses; Equivalent circuits; Frequency; Integrated circuit interconnections; Microstrip; Packaging; Scattering parameters; Solid modeling; Transmission line discontinuities;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594121
