Title :
A materials database for microwave packaging design
Author :
Harris, H.M. ; Rucker, C.T. ; Farley, J.R.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A joint services project to develop a microwave materials database is described. The major goal is to improve the availability of accurate data on the “high tech materials” needed for cost-effective production of microwave packages
Keywords :
integrated circuit packaging; availability; cost-effective production; high tech materials; joint services project; materials database; microwave packaging design; Aerospace materials; Assembly; Databases; Electromagnetic heating; Electronics packaging; Integrated circuit packaging; Semiconductor device packaging; Temperature; Thermal conductivity; Thermal expansion;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594122
