Title :
A thin films on MLC application
Author :
Leung, George B. ; Sands, Scott A.
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
Abstract :
The ability to create and process thin-film metal patterns directly on a multilayer ceramic (MLC) substrate has been demonstrated. The direct patterning of an MLC substrate with thin-film metallurgy enhances the substate by minimizing the number of layers required for device grid redistribution and increasing the device interconnection capability. It affords process simplification and good manufacturability as a result. The System 390-Air Cooled Thermal Conduction Module is a multidevice module with thin-film metallurgy that provides interconnection for a 10×10 device array in the test vehicle format and an 11×11 device array in the product format. The authors describe the thin film process
Keywords :
ceramics; hybrid integrated circuits; metallisation; substrates; MLC application; MLC substrate; System 390; Thermal Conduction Module; air cooled modules; device interconnection capability; direct patterning; manufacturability; multichip modules; multidevice module; multilayer ceramic; product format; test vehicle format; thin film process; thin-film metal patterns; thin-film metallurgy; Capacitors; Ceramics; Dielectric substrates; Dielectric thin films; Metallization; Rough surfaces; Surface roughness; Surface treatment; Thin film devices; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163844
