Title :
Electroless gold plating for high density packages
Author_Institution :
Hebei Semicond. Res. Inst., Shijiazhuang, China
Abstract :
A high-density package manufacturing process is briefly described. The role, performance, and application of the electroless nickel and gold plating in the IC package manufacturing process are discussed. The superiority of electroless plating over electrolytic plating is shown. It is concluded that electroless nickel-boron and gold plating for high-density packages provide excellent solderability, corrosion resistance, and electrical performance to meet the requirements of the VLSI fabrication process. Electroless plating is found to be the best choice in multilayer ceramic package manufacturing, especially in high pin (lead) count IC package manufacturing
Keywords :
electroless deposition; gold; microassembling; nickel; packaging; Au electroless plating; IC package; Ni electroless plating; VLSI fabrication process; corrosion resistance; electrical performance; electroless plating; high density packages; high pin-count packages; manufacturing process; multilayer ceramic package; solderability; Application specific integrated circuits; Corrosion; Electric resistance; Fabrication; Gold; Integrated circuit packaging; Manufacturing processes; Nickel; Nonhomogeneous media; Very large scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163847
