Title :
Interconnect characterization using time domain reflectometry
Author :
Corey, Steve ; Yang, Andrew T.
Author_Institution :
Washington Univ., Seattle, WA, USA
Abstract :
An approach is presented for macromodeling interconnect circuitry based on measured time domain reflectometry (TDR) data. In two example circuits which are macromodeled, delay, reflection, transmission, and crosstalk are accurately simulated as compared to measured data
Keywords :
time-domain reflectometry; TDR data; crosstalk; delay; interconnect characterization; macromodeling; reflection; time domain reflectometry; transmission; Circuit simulation; Coupling circuits; Crosstalk; Delay; Frequency; Integrated circuit interconnections; Packaging; Reflectometry; Solid modeling; Voltage;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594139
