Electrical characterization of interconnects and materials for high speed computer packaging system

Author

Arabi, Tawfik ; Pomerleau, Real ; Jong, Jyh-Ming ; Tripathi, Vijai K.

Author_Institution

Intel Corp., Hillsboro, OR, USA

fYear

1994

fDate

2-4 Nov 1994

Firstpage

192

Lastpage

194

Abstract

A technique for the wide band characterization of the interconnect losses in printed circuit boards is presented. The accuracy of the technique is enhanced by using time domain transformations to virtually eliminate the FFT associated errors. The de-embedding procedure applied in this paper is well suited to the wide band characterization of dielectric materials in a production like environment. The usefulness and accuracy of the approach is demonstrated by measurements

Keywords

packaging; FFT errors; deembedding procedure; dielectric materials; electrical characterization; high speed computer packaging system; interconnect characterisation; interconnect losses; materials characterisation; printed circuit boards; production environment; time domain transformations; wideband characterization; Bandwidth; Costs; Dielectric losses; Dielectric materials; Integrated circuit interconnections; Optical pulse generation; Packaging; Pulse measurements; Space vector pulse width modulation; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on

Conference_Location

Monterey, CA

Print_ISBN

0-7803-2411-0

Type

conf

DOI

10.1109/EPEP.1994.594140

Filename

594140