DocumentCode
2030074
Title
Sensors for robotic assembly
Author
Brennemann, A.E. ; Hollis, R.L. ; Lavin, M.A. ; Musits, B.L.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1988
fDate
24-29 Apr 1988
Firstpage
1606
Abstract
Special-purpose sensors and hybrid mechanical systems have been developed to assemble advanced electronic circuits. State-of-the-art robot systems that are used for electronic assembly and accuracy requirements for the developing surface mount technology are reviewed, showing the need for improved robot positioning capability. Examples of laboratory experiments that demonstrated successful precision assembly or testing using an ordinary robot, a micropositioner, and an optical sensing system are given. These involve fiber-optic sensing, machine-vision endpoint sensing, and hybrid tactic-vision endpoint sensing
Keywords
assembling; electronic equipment manufacture; fibre optic sensors; image sensors; industrial robots; position control; tactile sensors; electronic circuit assembly; fiber-optic sensing; hybrid tactic-vision endpoint sensing; industrial robots; machine-vision; micropositioner; optical sensing system; robotic sensors; Assembly systems; Circuit testing; Electronic circuits; Laboratories; Mechanical sensors; Mechanical systems; Robot sensing systems; Robotic assembly; Sensor systems; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation, 1988. Proceedings., 1988 IEEE International Conference on
Conference_Location
Philadelphia, PA
Print_ISBN
0-8186-0852-8
Type
conf
DOI
10.1109/ROBOT.1988.12296
Filename
12296
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