DocumentCode :
2030129
Title :
Measurement of package inductance and capacitance matrices
Author :
Young, Brian ; Sparkman, Aubrey
Author_Institution :
Motorola Inc., Austin, TX, USA
fYear :
1994
fDate :
2-4 Nov 1994
Firstpage :
195
Lastpage :
198
Abstract :
A method is presented for measuring the full and dense inductance and capacitance matrices for electronic packages. General theory is supplied based on multiple one- and two-port S-parameter measurements
Keywords :
S-parameters; S-parameter measurements; capacitance matrices; electronic packages; inductance matrices; package capacitance; package inductance; Capacitance measurement; Circuits; Electric variables measurement; Electronics packaging; Equations; Frequency; Inductance measurement; Instruments; Noise measurement; Probes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
Type :
conf
DOI :
10.1109/EPEP.1994.594141
Filename :
594141
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2030129
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