Title :
Hybrid-monolithic frequency converter device created with LTCC technology, using flip-chip
Author :
Gusev, A.P. ; Pavlov, A.V. ; Pavlova, S.G. ; Myakin´kov, V.Yu. ; Sinitsina, T.V. ; Sytilin, S.N.
Author_Institution :
FSUE RPC “ISTOK”, Fryazino, Russia
Abstract :
In the article the results of development of hybrid monolithic frequency converter multilayer microwave LTCC device of FSUE “RPC “Istok” are presented. For improvement of frequency selection, decrease of overall dimensions and increase of reliability the flip-chip technology of die mounting has been used.
Keywords :
MMIC frequency convertors; ceramic packaging; flip-chip devices; hybrid integrated circuits; integrated circuit packaging; integrated circuit reliability; multilayers; FSUE “RPC “Istok”; die mounting; flip-chip technology; frequency selection; hybrid monolithic frequency converter device; multilayer microwave LTCC device; reliability; Abstracts; Electronic mail; Flip-chip devices; Frequency conversion; Nonhomogeneous media; Region 8; SAW filters;
Conference_Titel :
Microwave and Telecommunication Technology (CriMiCo), 2013 23rd International Crimean Conference
Conference_Location :
Sevastopol
Print_ISBN :
978-966-335-395-1