DocumentCode
2030176
Title
Hybrid-monolithic frequency converter device created with LTCC technology, using flip-chip
Author
Gusev, A.P. ; Pavlov, A.V. ; Pavlova, S.G. ; Myakin´kov, V.Yu. ; Sinitsina, T.V. ; Sytilin, S.N.
Author_Institution
FSUE RPC “ISTOK”, Fryazino, Russia
fYear
2013
fDate
8-14 Sept. 2013
Firstpage
86
Lastpage
87
Abstract
In the article the results of development of hybrid monolithic frequency converter multilayer microwave LTCC device of FSUE “RPC “Istok” are presented. For improvement of frequency selection, decrease of overall dimensions and increase of reliability the flip-chip technology of die mounting has been used.
Keywords
MMIC frequency convertors; ceramic packaging; flip-chip devices; hybrid integrated circuits; integrated circuit packaging; integrated circuit reliability; multilayers; FSUE “RPC “Istok”; die mounting; flip-chip technology; frequency selection; hybrid monolithic frequency converter device; multilayer microwave LTCC device; reliability; Abstracts; Electronic mail; Flip-chip devices; Frequency conversion; Nonhomogeneous media; Region 8; SAW filters;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Telecommunication Technology (CriMiCo), 2013 23rd International Crimean Conference
Conference_Location
Sevastopol
Print_ISBN
978-966-335-395-1
Type
conf
Filename
6652620
Link To Document