DocumentCode :
2030370
Title :
Experimental electrical characterization of high speed interconnects
Author :
Goldberg, Steven B. ; Steer, Michael B. ; Franzon, Paul D. ; Kasten, Jettery S.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear :
1991
fDate :
11-16 May 1991
Firstpage :
85
Lastpage :
88
Abstract :
The authors present measurement techniques to experimentally characterize the electrical performance of interconnects on printed circuit boards and multichip modules. Novel techniques for calibrated measurements of two-port and three-port structures are presented. Measurements of a transmission line, a via, and a tee on a printed circuit board are presented
Keywords :
hybrid integrated circuits; microwave measurement; printed circuits; strip line components; strip lines; MCMs; PCBs; calibrated measurements; electrical characterization; electrical performance; high speed interconnects; measurement techniques; microstrip tee; multichip modules; printed circuit boards; three-port structures; transmission line; two port structures; via; Calibration; Circuit simulation; Distributed parameter circuits; Fixtures; Frequency; Integrated circuit interconnections; Printed circuits; Transmission line discontinuities; Transmission line measurements; Transmission line theory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
Type :
conf
DOI :
10.1109/ECTC.1991.163858
Filename :
163858
Link To Document :
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