Experimental electrical characterization of high speed interconnects

Author

Goldberg, Steven B. ; Steer, Michael B. ; Franzon, Paul D. ; Kasten, Jettery S.

Author_Institution

Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA

fYear

1991

fDate

11-16 May 1991

Firstpage

85

Lastpage

88

Abstract

The authors present measurement techniques to experimentally characterize the electrical performance of interconnects on printed circuit boards and multichip modules. Novel techniques for calibrated measurements of two-port and three-port structures are presented. Measurements of a transmission line, a via, and a tee on a printed circuit board are presented

Keywords

hybrid integrated circuits; microwave measurement; printed circuits; strip line components; strip lines; MCMs; PCBs; calibrated measurements; electrical characterization; electrical performance; high speed interconnects; measurement techniques; microstrip tee; multichip modules; printed circuit boards; three-port structures; transmission line; two port structures; via; Calibration; Circuit simulation; Distributed parameter circuits; Fixtures; Frequency; Integrated circuit interconnections; Printed circuits; Transmission line discontinuities; Transmission line measurements; Transmission line theory;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163858

Filename

163858