Combination of numerical and experimental methods for stress analysis of small electronic components

Author

Villain, J. ; Borner, H.

Author_Institution

Siemens Nixdorf Informationssyst. AG, Munich, Germany

fYear

1991

fDate

11-16 May 1991

Firstpage

89

Lastpage

95

Abstract

Examples of the development of a multichip module with extremely loaded components are presented. They show that a reasonable combination of experimental methods, e.g. holographic interferometry, metallography, and a good knowledge of the specific material behavior under working conditions, results in better numerical simulation under realistic boundary conditions. Optimized finite-element method models and their boundary conditions based on experimental results allow shape and material optimization during the development phase to achieve components with high reliability in a short development time by minimizing the required number of prototypes

Keywords

finite element analysis; hybrid integrated circuits; modules; packaging; reliability; stress analysis; surface mount technology; tape automated bonding; MCM; SMT; TAB; boundary conditions; experimental methods; experimental results; finite-element method models; high reliability; holographic interferometry; loaded components; material optimization; metallography; module development; multichip module; numerical simulation; shape optimisation; small electronic components; stress analysis; Boundary conditions; Employee welfare; Finite element methods; Holography; Inorganic materials; Interferometry; Multichip modules; Numerical simulation; Optimization methods; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163859

Filename

163859