Title :
Hybrid technologies for high frequency switching power supplies
Author :
Belopolsky, Yakov ; Dassatti, Rick
Author_Institution :
du Pont de Nemours, Wilmington, DE, USA
Abstract :
The authors review the technical requirements and driving forces leading to the introduction of fourth-generation high-frequency power supplies in advanced computers and telecommunication equipment. Thermal management, a critical issue for all power designs, was the subject of an experimental study. A 100-W DC-DC converter was designed and built using insulated metal substrate, FR4, and thick-film technologies. Using conventional thick-film technology, the board area was reduced by 44% over FR4 construction. An experimental substrate material of high thermal conductivity in combination with copper thick-film conductions was used to reduce the size of a converter to 39% of the original FR4 design. Computer modeling was used extensively in the design process. The properties and comparative performance of material systems are tabulated
Keywords :
hybrid integrated circuits; printed circuits; switched mode power supplies; thick film circuits; 100 W; DC-DC converter; FR4; HF SMPS; board area; cooling; fourth generation power supplies; high frequency; high thermal conductivity; high-frequency power supplies; hybrid technologies; insulated metal substrate; material systems; performance; substrate material; switching power supplies; technical requirements; thermal management; thick-film technologies; Conducting materials; DC-DC power converters; Energy management; Frequency; Insulation; Power supplies; Telecommunication computing; Telecommunication switching; Thermal conductivity; Thermal management;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163861
