DocumentCode :
2030977
Title :
A low temperature cofired multilayer ceramic delay line with copper conductors
Author :
Mandai, Harufumi ; Chigodo, Yoshikazu ; Tojo, Atushi
Author_Institution :
Murata Manufacturing Co. Ltd., Kyto, Japan
fYear :
1991
fDate :
11-16 May 1991
Firstpage :
127
Lastpage :
133
Abstract :
A distributed type chip delay line made of low-temperature fireable ceramics cofired with copper conductors has been developed. This product has very good stability at high frequency, metal shield layers built inside the chip, and features high reliability. This delay line is expected to be used for various high-frequency circuits, especially those requiring small devices: optical link interfaces, high-frequency measurement equipment, and supercomputers, for example
Keywords :
ceramics; copper; delay lines; equivalent circuits; thick film circuits; Cu conductors; MLC; cofired multilayer ceramic delay line; distributed type chip delay line; high-frequency circuits; low-temperature fireable ceramics; metal shield layers; reliability; stability; Ceramics; Circuit stability; Conductors; Copper; Delay lines; Frequency; Nonhomogeneous media; Optical fiber communication; Semiconductor device measurement; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
Type :
conf
DOI :
10.1109/ECTC.1991.163864
Filename :
163864
Link To Document :
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