• DocumentCode
    2031619
  • Title

    Optoelectronics packaging needs for data communications

  • Author

    Warren, Richard ; Lasky, Ronald ; Radcliffe, Jerry ; Stigliani, Daniel

  • Author_Institution
    IBM Corp., Endicott, NY, USA
  • fYear
    1991
  • fDate
    11-16 May 1991
  • Firstpage
    161
  • Lastpage
    168
  • Abstract
    It is pointed out that the growth of optoelectronics in the telecommunications marketplace has been steadily increasing since 1970. This technology is now migrating into data communications applications. However, the technical challenges of data communications are significantly different to those of telecommunications. The authors examine the marketing potential of data and elaborate the technical differences between data communications and telecommunications environments. Key technical elements are identified along with relative cost implications. Five technology challenges and their impact on data communications technology products are discussed
  • Keywords
    data communication equipment; optoelectronic devices; packaging; data communications; marketing potential; optoelectronics; packaging; technology challenges; telecommunications environments; Bandwidth; Communication industry; Computer industry; Copper; Costs; Data communication; Optical fiber cables; Packaging; Telecommunications; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1991. Proceedings., 41st
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0012-2
  • Type

    conf

  • DOI
    10.1109/ECTC.1991.163870
  • Filename
    163870