DocumentCode
2031619
Title
Optoelectronics packaging needs for data communications
Author
Warren, Richard ; Lasky, Ronald ; Radcliffe, Jerry ; Stigliani, Daniel
Author_Institution
IBM Corp., Endicott, NY, USA
fYear
1991
fDate
11-16 May 1991
Firstpage
161
Lastpage
168
Abstract
It is pointed out that the growth of optoelectronics in the telecommunications marketplace has been steadily increasing since 1970. This technology is now migrating into data communications applications. However, the technical challenges of data communications are significantly different to those of telecommunications. The authors examine the marketing potential of data and elaborate the technical differences between data communications and telecommunications environments. Key technical elements are identified along with relative cost implications. Five technology challenges and their impact on data communications technology products are discussed
Keywords
data communication equipment; optoelectronic devices; packaging; data communications; marketing potential; optoelectronics; packaging; technology challenges; telecommunications environments; Bandwidth; Communication industry; Computer industry; Copper; Costs; Data communication; Optical fiber cables; Packaging; Telecommunications; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-0012-2
Type
conf
DOI
10.1109/ECTC.1991.163870
Filename
163870
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