Abstract :
The following topics are dealt with: advanced packaging; wafer level packaging; interconnection technologies; emerging technologies; electrical modeling; mechanical modeling; thermal characterization; cooling solutions; and wafer-package testing.
Keywords :
cooling; interconnections; packaging; advanced packaging; cooling solutions; electrical modeling; emerging technologies; interconnection technologies; mechanical modeling; thermal characterization; wafer level packaging; wafer-package testing;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507038
