Title :
The Development of the Non-contact Electrical Leakage Property Measurement System for the High-K Dielectric Materials on DRAM Capacitors
Author :
Yang, Yusin ; Lee, Byung Sug ; Lee, Misung ; Jun, Chung Sam ; Kim, Tae Sung
Author_Institution :
Samsung Electron. Co., Hwasung
Abstract :
We have used the non-contact electrical property measurement system to characterize the electrical leakage property of high-K materials such as Al2O3 and HfO2 on a patterned wafer. The basic technology is to measure the surface voltage with micro Kelvin probe after the corona charge deposition on a measurement area. Because of the charge decay through a dielectric material, voltage-time spectra follow exponential time dependence that is the characteristic of leakage induced charge decay. We have measured the electrical leakage property of the storage capacitors on the direct cell area of DRAM device. The measured electrical leakage property can be classified according to the thickness of Al2O3 and HfO2. Since the electrical leakage property depends on a thickness of a dielectric material, voltage-time spectra show different shapes according to the HfO2 thickness. Using the technology, we can monitor the electrical leakage property of the storage capacitors of high-K materials on the direct cell area
Keywords :
DRAM chips; aluminium compounds; capacitors; dielectric materials; discharges (electric); fault diagnosis; hafnium compounds; leakage currents; Al2O3; DRAM capacitors; HfO2; charge decay; corona charge deposition; exponential time dependence; high-K dielectric materials; micro Kelvin probe; noncontact electrical leakage measurement; patterned wafer; storage capacitors; surface voltage; voltage-time spectra; Area measurement; Capacitors; Current measurement; Dielectric measurements; Electric variables measurement; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Random access memory; Voltage;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location :
Boston, MA
Print_ISBN :
1-4244-0254-9
DOI :
10.1109/ASMC.2006.1638715