• DocumentCode
    2032190
  • Title

    NEMS based thermal management for 3D many-core system

  • Author

    Huang, Xiwei ; Yu, Hao ; Zhang, Wei

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2011
  • fDate
    8-9 June 2011
  • Firstpage
    218
  • Lastpage
    223
  • Abstract
    Leakage power has become the dominant factor to the total power consumption when technology scales down to nano-region. Moreover, due to the exponential relationship between leakage power and temperature, positive feedback loop can cause thermal-runaway hazard. This poses a significant barrier for 3D integration of multi-cache-core processor, which has high I/O bandwidth but also has high leakage-power density and long heat-removal path. Nano-Electro-Mechanical Switches (NEMS) are among the most promising emerging devices to solve the thermal-runaway problem due to their zero leakage current and infinite sub-threshold slope. In order to have a proper control of thermal-runaway hazard for many-core system, this paper studies hybrid CMOS-NEMS designs of thermal buffer and power gating to reduce leakage power and thermal-runaway at thermal-time-constant scale. Experimental results show that our proposed NEMS based thermal management can effectively prevent the thermal-runaway in 3D multi-cache-core processor.
  • Keywords
    CMOS integrated circuits; leakage currents; microprocessor chips; multiprocessing systems; nanoelectromechanical devices; thermal management (packaging); 3D integration; 3D many-core system; 3D multi-cache-core processor; heat-removal path; hybrid CMOS-NEMS designs; leakage current; leakage power; positive feedback loop; power gating; sub-threshold slope; thermal buffer; thermal management; thermal-runaway hazard; thermal-time-constant scale; CMOS integrated circuits; CMOS technology; Heating; Nanoelectromechanical systems; Thermal management; Three dimensional displays; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoscale Architectures (NANOARCH), 2011 IEEE/ACM International Symposium on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4577-0993-7
  • Type

    conf

  • DOI
    10.1109/NANOARCH.2011.5941507
  • Filename
    5941507