DocumentCode :
2032214
Title :
Full wave characterization of a through hole via discontinuity in multi-layered packaging
Author :
Hsu, Show-Gwo ; Wu, Ruey-Beei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
1994
fDate :
2-4 Nov 1994
Firstpage :
219
Lastpage :
222
Abstract :
The frequency dependent propagation characteristics of a via penetrating through a hole in a ground plane in multi-layered packaging were investigated by a full wave numerical approach
Keywords :
packaging; frequency dependent propagation; full wave numerical analysis; ground plane; multilayered packaging; through hole via discontinuity; Councils; Distributed parameter circuits; Electromagnetic scattering; Electromagnetic waveguides; Frequency dependence; Microstrip; Packaging; Stripline; Transmission line matrix methods; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
Type :
conf
DOI :
10.1109/EPEP.1994.594151
Filename :
594151
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2032214
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