DocumentCode
2032214
Title
Full wave characterization of a through hole via discontinuity in multi-layered packaging
Author
Hsu, Show-Gwo ; Wu, Ruey-Beei
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
1994
fDate
2-4 Nov 1994
Firstpage
219
Lastpage
222
Abstract
The frequency dependent propagation characteristics of a via penetrating through a hole in a ground plane in multi-layered packaging were investigated by a full wave numerical approach
Keywords
packaging; frequency dependent propagation; full wave numerical analysis; ground plane; multilayered packaging; through hole via discontinuity; Councils; Distributed parameter circuits; Electromagnetic scattering; Electromagnetic waveguides; Frequency dependence; Microstrip; Packaging; Stripline; Transmission line matrix methods; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594151
Filename
594151
Link To Document