• DocumentCode
    2032337
  • Title

    In situ heating to improve adhesion for parylene-on-parylene deposition

  • Author

    Kang, Dongyang ; Chang, Jay Han-Chieh ; Kim, Justin Young-Hyun ; Tai, Yu-Chong

  • Author_Institution
    Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2012
  • fDate
    5-8 March 2012
  • Firstpage
    226
  • Lastpage
    229
  • Abstract
    A new technique of using “in-situ heating” to enhance adhesion for parylene-on-parylene deposition is reported in this paper. This method is compared with existing physical or chemical adhesion-enhancing methods and the results show clear advantages of this new technique. The physics is believed to be that the mobility of deposition-involved molecules (including the substrate parylene polymer chains and adsorbed monomers during deposition) is enhanced when deposition temperature rises, especially above the glass transition temperature of the substrate parylene. Each sample is patterned and then soaked in 0.9% saline at 90°C, and the undercut between two parylene layers due to the attack from saline during the soaking test could be observed. The undercut rate is measured to quantify the adhesion strength.
  • Keywords
    adhesion; coating techniques; polymers; process heating; adhesion strength; adsorbed monomers; chemical adhesion-enhancing methods; deposition-involved molecules; glass transition temperature; in situ heating; parylene-on-parylene deposition; soaking test; substrate parylene polymer chains; Heating; Nanoelectromechanical systems; Polymers; Substrates; Switches; PA-C substrate; adhesion; in-situ heating; undercut;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4673-1122-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2012.6196762
  • Filename
    6196762