DocumentCode
2032337
Title
In situ heating to improve adhesion for parylene-on-parylene deposition
Author
Kang, Dongyang ; Chang, Jay Han-Chieh ; Kim, Justin Young-Hyun ; Tai, Yu-Chong
Author_Institution
Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
fYear
2012
fDate
5-8 March 2012
Firstpage
226
Lastpage
229
Abstract
A new technique of using “in-situ heating” to enhance adhesion for parylene-on-parylene deposition is reported in this paper. This method is compared with existing physical or chemical adhesion-enhancing methods and the results show clear advantages of this new technique. The physics is believed to be that the mobility of deposition-involved molecules (including the substrate parylene polymer chains and adsorbed monomers during deposition) is enhanced when deposition temperature rises, especially above the glass transition temperature of the substrate parylene. Each sample is patterned and then soaked in 0.9% saline at 90°C, and the undercut between two parylene layers due to the attack from saline during the soaking test could be observed. The undercut rate is measured to quantify the adhesion strength.
Keywords
adhesion; coating techniques; polymers; process heating; adhesion strength; adsorbed monomers; chemical adhesion-enhancing methods; deposition-involved molecules; glass transition temperature; in situ heating; parylene-on-parylene deposition; soaking test; substrate parylene polymer chains; Heating; Nanoelectromechanical systems; Polymers; Substrates; Switches; PA-C substrate; adhesion; in-situ heating; undercut;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location
Kyoto
Print_ISBN
978-1-4673-1122-9
Type
conf
DOI
10.1109/NEMS.2012.6196762
Filename
6196762
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