DocumentCode
2032363
Title
Biocompatible packaging development for an intracranial microsystem
Author
Lim Ruiqi ; Tan Ee Lim ; Tan Kwan Ling ; Narducci, Margarita Sofia ; Sun Tao ; Cheng Ming-Yuan
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear
2012
fDate
5-7 Dec. 2012
Firstpage
43
Lastpage
47
Abstract
Traumatic brain injury (TBI) can be worsen by the secondary brain injury which will the major prognostic factor for the patient condition. The major parameters for monitoring the TBI are the intracranial pressure, partial brain oxygen level and the brain temperature. This leads to the development of an integrated intracranial microsystem which effectively monitored the condition of the TBI patient. This paper will present the biocompatible packaging and its in-vitro result for the microsytem.
Keywords
bioMEMS; electronics packaging; patient monitoring; TBI monitoring; TBI patient; biocompatible packaging; brain temperature; integrated intracranial microsystem; intracranial pressure; partial brain oxygen level; secondary brain injury; traumatic brain injury; Biomedical imaging; Curing; Media; Monitoring; Substrates; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location
Singapore
Print_ISBN
978-1-4673-4553-8
Electronic_ISBN
978-1-4673-4551-4
Type
conf
DOI
10.1109/EPTC.2012.6507048
Filename
6507048
Link To Document