• DocumentCode
    2032683
  • Title

    Fabrication of nanogap electrode using electromigration method during metal deposition

  • Author

    Ohata, Takuma ; Naitoh, Y. ; Horikawa, M. ; Wang, Dong ; Maeda, Ryutaro

  • Author_Institution
    Micro Eng. & Micro Syst. Lab., Ibaraki Univ., Hitachi, Japan
  • fYear
    2012
  • fDate
    5-8 March 2012
  • Firstpage
    290
  • Lastpage
    293
  • Abstract
    In this paper, we suggest a new electormigration method to improve the previous electromigration method. The method is that electrical break-down is carried out during metal deposition for the fabrication of electrodes. As a result, the nanogap structure can be confirmed and break-down current showed lower magnitudes than the previous method. These result indicated possibility of applications to mass production of nanogap electrodes.
  • Keywords
    electric breakdown; electrochemical electrodes; electromigration; energy gap; gold; nanofabrication; nanostructured materials; Au-Si; Si; breakdown current; electrical breakdown; electromigration; gold deposition; nanogap electrode; nanogap structure; silicon substrate; Electrodes; Metals; Nanoelectromechanical systems; electromigration; nanogap;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4673-1122-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2012.6196777
  • Filename
    6196777