DocumentCode :
2032714
Title :
Grounding resistance of grounding electrode using carbon plate made of woody material
Author :
Shimizu, Hirotaka ; Watanabe, Nobuhiro
Author_Institution :
Dept. of Electr. Syst. Eng., Polytech. Univ., Sagamihara, Japan
fYear :
2012
fDate :
2-7 Sept. 2012
Firstpage :
1
Lastpage :
4
Abstract :
Woodceramics is a carbon material made of woody material and is expected as an eco-material. The woodceramics can be used as an electrical conductor. To estimate the feasibility of the woodceramics as grounding electrode, the woodceramics plate was fabricated and the fundamental properties were investigated as grounding electrode. The resistance and density were measured by simple methods. The resistance of woodceramics plate was sufficiently low when the woodceramics was manufactured under the condition of annealing temperature of higher than 800 °C. The woodceramics plate had about one-ninth density the copper plate. The grounding resistance was also estimated. The grounding resistance of woodceramics electrode per 1 m2 was about 40 Ω and almost equal to that in case that copper grounding electrode was used. Furthermore, the impedance of the woodceramics electrode for surge current was measured. It was confirmed that the magnitude was sufficiently small. It was pointed out that the woodceramics can be applied to the grounding electrode.
Keywords :
annealing; ceramics; conductors (electric); copper; earth electrodes; wood; annealing temperature; carbon plate; copper grounding electrode; copper plate; eco-material; electrical conductor; grounding resistance; surge current; woodceramics plate; woody material; Annealing; Copper; Electrodes; Grounding; Materials; Surface impedance; Surface resistance; carbon plate; groundign resistance; grounding electrode; woodceramics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lightning Protection (ICLP), 2012 International Conference on
Conference_Location :
Vienna
Print_ISBN :
978-1-4673-1898-3
Electronic_ISBN :
978-1-4673-1896-9
Type :
conf
DOI :
10.1109/ICLP.2012.6344327
Filename :
6344327
Link To Document :
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